Artificial Intelligence
Hugging Face inference-as-a-service capabilities with NVIDIA NIM
Hugging Face will now offer developers new inference-as-a-service capabilities which are powered by NVIDIA NIM.
Tech and AI stocks tumble – how, why, and what’s next?
The market turbulence, which saw major US stock indices experience their worst day in over 18 months on Wednesday, is creating a unique buying opportunity for savvy investors, particularly in the technology and artificial intelligence (AI) sectors.
AI expert to lead UK AI Action Plan
New UK Science Secretary, Peter Kyle, has put AI at the heart of the government’s agenda to deliver change, sustained economic growth, and improved public services.
AI could enhance two-thirds of UK jobs, Google reports
61 per cent of jobs in the UK could be significantly transformed by the integration of AI, with only a small fraction at risk of being "phased out" entirely, according to new research from Google.
Fractile raises $15M for AI chip development
Fractile, a UK company building a new AI chip to deliver exponential performance improvements for AI models, has exited stealth and announced $15 million (£12 million) in seed funding.
ODI finds shortage of quality data a threat to AI
In a recent whitepaper, ODI has found that a shortage of high-quality data threatens to disrupt the AI boom.
Meta’s Llama 3.1: what’s new?
Meta has recently introduced its newest range of AI models, Llama 3.1, so what’s new in this range and what might you expect to see?
Revolutionary AI trial for breast cancer diagnostics
Peterborough City Hospital have launched a groundbreaking trial, integrating artificial intelligence (AI) software into the digital pathology reporting of breast biopsies.
Getting ready for an AI-centric semiconductor world
Simon Butler, General Manager, Helix IPLM, Perforce talks about the transformative impact of AI on semiconductor design.
ASMPT and IBM advance bonding for AI Chiplet packages
ASMPT and IBM have announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies.