Application specific MOSFETs save automotive design space

Application specific MOSFETs - or ASFETs - have been developed by Nexperia specifically for automotive airbags (pictured). The application specific approach means designers can optimise parameters to suit a project and in particular to enhance the chip's SOA (safe operating area) and to minimise heat dissipation over time. 

The initial ASFET is the BUK9M20-60EL, a single N-channel, 60V, 13mΩ MOSFET in an LFPAK33 packaging. SOA trench technology is designed for "excellent transient linear mode performance" which is an important parameter for automotive design, explained Chris Boyce, senior director, marketing and product group BG MOS discretes at Nexperia.  The packaging choice requires less board space than a 70mm2 DPAK, and is estimated to result in around 70% real estate saving.

The company already offers a portfolio of ASFETs constructed using silicon trench technology and LFPAK packaging for battery isolation, motor control, hot-swap, and PoE.

Another automotive announcement by the company at PCIM Europe was that it was making 12 rectifiers available in its Clip-Bonded FlatPower (CFP2-HP) packaging. In additon to standard Schottky rectifiers, AECQ-101 versions are also available in 45, 60 and 100V versions, with 1.0 and 2.0A options. trench  are available. The company also offers the PMEG100T20ELXD-Q 100V, 2.0A trench Schottky barrier rectifier. For applications which require fast recovery, the  PNE20010EXD-Q rectifier us a 200V, 1.0A  model, also announced at the show in Nuremberg.

The smaller packages, saving up to 75% of board space compared to an SMA package, allows for greater flexibility in placing components for ECU controls yet maintains the electrical performance, said Nexperia. The package design is rugged and has a new lead shape which improves automatic optical inspection, adds the company.

CFP packaging is used for Nexperia’s Schottky, silicon germanium and recovery rectifiers but can also be extended to bipolar transistors. It offers significant product diversity, covering single/dual configuration and currents between 1-20 A, simplifying board design.