Products

A new concept in VME64x and CompactPCI rack-mounted system design is now available from Rittal in the form of a set of horizontally cooled housings. Assembled from a selection of backplane(s), power supplies, rear I/O, HDD and monitoring via a pick-and-mix process, the housings are able to accommodate two system slots per U of height (44.45mm).

Hammond Electronics has extended the capabilities of the 1457 extruded aluminium family of small enclosures with the introduction of RFI screened IP54 environmentally sealed versions. The 1457 E Series is designed to house PCBs, directly mounted horizontally into internal slots extruded in the case body; the units can also be used to house any small electronic, electrical or pneumatic components.

Ecopac Power has announced the release of the ECO-160 series open frame Ultra High Density power supply with 20W/in³ power density in a 2x4x1 footprint. The ECO-160 is a compact and low profile 160W AC/DC power supply ideal for applications and designs where space is at a premium. With 90% efficiency and a no load power consumption of less than 2.3W, it provides one of the highest efficiencies and power densities available from an open frame pow...

Toshiba Electronics Europe has added an entry-level device to its family of scalable, low-power ARM-based microcontrollers. The new TMPA913CHAXBG provides a cost-effective and low component count solution for industrial designs requiring high-speed USB connectivity and external memory management.

PowerPax has announced a range of miniature 30W DC/DC converters. The 30PVRB_LD Series is 40% smaller than the current industry standard package with dimensions of 50.8 x 25.4 x 11.5mm and has a power density of 2.28W/cm3.

Murata Power Solutions has added eight 12V input models to its DOSA compliant Okami range of non-isolated point-of-load (PoL) DC/DC converters. The latest additions comprise four 10A and four 16A output current surface mount (SMT) modules that provide an ideal drop-in replacement for other DOSA-compliant parts in space constrained designs that require high density, high efficiency power solutions.

picoChip has launched the picoXcell PC312 HSPA+ femtocell system-on-chip (SoC), the industry’s first such device to support eight users, with simultaneous voice and data services. Offering 64QAM modulation and 3GPP Release 7 features for high-speed communication, the device is the newest addition to the picoXcell PC3xx family of single-chip femtocells launched in 2008. All are fully pin-compatible and offer customers a seamless migration path.

Agilent today will demonstrate its SuperSpeed USB test solution portfolio here at the Developers Conference. This is the industry's first high-performance SuperSpeed USB test fixture coupled with NEC Electronics' USB 3.0 host controller. Agilent will also demonstrate its complete USB 3.0 portfolio, which consists of fully automated transmitter and receiver tests that are key to efficient compliance tests and systematic product characterization of...

Vishay has announced that it has extended the resistance tolerance of the QPL RNC90Y family of established reliability Bulk Metal Foil resistors down to ±0.005 %. For designers requiring higher or lower resistance values than the QPL range, but with the same performance capabilities, an S555 non-QPL version of the device is also available.

Tyco Electronics has announced the addition of a 10A version of its Corcom GG series general-purpose and HG series medical filtered power-entry modules. A 5-inch (127 mm) wire lead option has also been introduced for the HG medical modules to aid in module installation. Previously, the lines were offered in ratings of 1, 3, and 6 amps.