Products
Anritsu to Demonstrate LTE Tester Using LG Device at MWC
Anritsu Corporation is to give a demonstration of its LTE tester using LG Electronics’ (LG) LTE USB Modem at the Mobile World Congress (MWC) in Barcelona, which is being held from February 15 to 18, 2010.
LTE demonstration with a Samsung device at MWC
Anritsu Corporation announced its demonstration with the Samsung Electronics LTE USB Modem at Barcelona Mobile World Congress (MWC) from the 15th to 18th February 2010.
Sierra Wireless to Demonstrate Dual-Carrier HSPA Evolution Modem Performance Using Anritsu HSPA Solution at Mobile World Congress
Anritsu Corporation announces that its MD8480C Signaling Tester with Dual-Carrier HSPA Evolution support has been selected by Sierra Wireless to demonstrate performance of the Sierra Wireless AirCard® 312U mobile broadband modem at Mobile World Congress (MWC). The demonstration is showcased at the Anritsu stand 1B31 during MWC, held in Barcelona, February 15-18.
Anritsu’s ME7873L LTE RF Conformance Test System Achieves R&TTE verification
Anritsu Corporation announced that its ME7873L LTE RF Conformance Test System has become the first in the world to provide independently verified European Radio equipment and Telecommunications Terminal Equipment (R&TTE) RF test cases for Type Approval of LTE devices.
Futuristic, interactive dining experience facilitated by Zytronic’s Projected Capacitive Technology (PCT™)-based touch sensors
A 22-inch version of Zytronic’s durable touch sensor product, ZYBRID, has been chosen by advanced user interface specialist, Sunvision Technology, to create interactive dining tables which offer customers a new, entertaining dining experience at the exclusive Mojo restaurant in Taipei. Interactive functionality is enabled by embedding the ZYBRID touch sensors inside the restaurant’s tabletops. The touchscreen operates in conjunction with a c...
Spirent Intros New Testing & Monitoring Solution for Mobile Backhaul
Spirent Communications plc., a leader in networks, devices and services testing, today introduced Spirent TestCenter Live, the industry's first integrated 1/10 Gigabit Ethernet (GigE) live network test, diagnostics and performance monitoring solution. Deployed by several providers including a leading North American 4G wireless operator, Spirent TestCenter Live reduces operational costs, increases service quality levels of the Ethernet backhaul an...
Vishay’s New-Generation, Ultra-Precision VHP100 Bulk Metal Foil Resistor Wins Product of the Year Award from Electronic Products Magazine
Vishay Intertechnology announced that the new generation of its VHP100 hermetically sealed Bulk Metal® Foil resistor, which sets a new industry benchmark for ultra-high precision, has won a Product-of-the-Year award from industry magazine Electronic Products.
NXP’s New 120 MHz ARM Cortex-M3 Microcontrollers Top DSP Benchmarks
NXP Semiconductors today announced availability of the LPC1769 and LPC1759 microcontrollers that operate at 120 MHz, the fastest ARM Cortex-M3 MCUs in the industry. At this level of performance, integration of microcontroller control and signal processing becomes a reality for cost constrained applications eliminating the need for dedicated DSP hardware.
ST-Ericsson and STMicroelectronics to Support Adobe Flash Player 10.1 on Smartphones and Other Devices
STMicroelectronics and ST-Ericsson, a global leader in mobile platforms and semiconductors, are working with Adobe to accelerate Adobe® Flash® Player 10.1 and Adobe AIR® on their powerful chipsets with best-in-class multimedia and graphics capabilities, used in smartphones and connected digital-home devices.
C-MAC MicroTechnology announces further development of high temperature DC-DC converters
C-MAC MicroTechnology today announced it has extended its agreement with CISSOID to integrate Vesuvio™ technology into high temperature DC-DC converter designs featuring their latest Magma and Hyperion semiconductor devices. Following on from the successful 20 Watt module based around the original ETNA chip set, these new state-of-the-art modules offer further improvements in efficiency and packaging density and provide multiple output voltage...