Products
Broadcom Strengthens TV Market with New Satellite Out Door Unit Technology
Broadcom Corporation today announced its entry into the satellite Out Door Unit market with its 40nm BCM4550 Full-Band Capture Satellite Channel Stacker Solution. Broadcom is leveraging its expertise in satellite STB technology to scale into the ODU market.
ASL launches F650 precision thermometry bridge
ASL has today introduced the F650 precision thermometry bridge, a significant enhancement to its best selling F600 and F700 ranges. Based on proven and exceptionally stable AC bridge technology, the F650 provides high accuracy temperature measurement and calibration, accurate to +/- 1ppm over the full range (typically +/- 0.25mK, at 0.01ºC).
ULIS seeks larger slice of infrared sensor market
ULIS announced today that the company will collaborate with CEA/Leti, a leading international technology research centre, in a project to develop and market a new line of infrared sensors.
ROHM Semiconductor Introduces Its Non-isolated, High-Power 3-Pin DC/DC Converter Modules BP5277 Series
Rohm presents its new high voltage resistance, high efficiency DC/DC Converter module BP5277 family which eliminates the need of external components and thermal design. Configuring a DC/DC converter used to be complicated and time-consuming, starting with the selection of ICs for the loads and covering circuit design as well as the selection of constants e.g. those for phase compensation, board design for obtaining desired characteristics, and th...
Low Cost Cabinet Hardware Management Interface
To complement the Austin Hughes Smart range of Card Handles, PDUs and Fan Units, they have now developed a simple graphic user interface to centralize the management of either a small or large number of data centre server cabinets. This allows intelligent secure physical layer card access that remotely releases the cabinets locking handles as well remote management of intelligent PDUs and fan units. The management interface includes a front end f...
Small footprint wireless USB keyboard offers improved functionality
Bytec Embedded, the embedded equipment manufacturer of the Bytec group, has launched the next generation of its small footprint, wireless, USB keyboard designed for harsh environments. The second generation Indi-KeyTM keyboard now offers improved key response and feel, a wider touchpad and an optional numeric keypad.
OpenATE released QSPI and presents two applications for SEMICONDUCTOR Test
OpenATE has designed and manufactured a powerful QSPI module which provides the serial interface, offers high volume, multi-site serial bus testing capability. Each QSPI card can test four sites simultaneously , the maximum is 64 site for MEMS product testing. QSPI can support 2 pattern modes. One is static pattern and command I/O. QSPI's unique functions can optimize production efficiency.
Weald’s 38999 Series III High Power Connectors Suit Demanding Military Applications
A new series of high power connectors based on the established D38999 Series III platform and specifically designed for demanding military applications is announced by Weald Electronics, the leading UK manufacturer of high performance connectors for demanding environments.
First Industry Demonstration Of Vocis Twin Speed EV Transmission At Forthcoming Low Carbon Vehicle (lCV) Show
Transmission engineering and control specialist Vocis will give its novel twin speed electric vehicle (EV) transmission its first public demonstration at LCV2011 (the Low Carbon Vehicle show) on September 7-8, at Rockingham Motor Speedway. Technical specialists from the company will be on hand to provide an insight into the technology and the efficiency, performance and range benefits it offers for the next generation of EVs.
Picochip and ASTRI announce availability of first commercial-grade LTE small cell reference design
Picochip and Hong Kong Applied Science and Technology Research Institute (ASTRI) has announced that they have successfully completed the design and validation of the PC8609, the industry’s first commercial-grade LTE FDD femtocell physical layer software. The PC8609 software is now generally available (GA) to Picochip’s customers around the world.