Products
Kontron adds ECO-AML/ADN and PRO-RPL to FlatClient Panel PC line
Kontron, a global provider of IoT/Embedded Computer Technology (ECT), is now also using processors from the Intel N and Intel Core i3 N series as well as Intel Atom X7000 processors (code-named 'Alderlake N' and 'Amston Lake') in its FlatClient ECO Panel PC series, which offer particularly high processor and graphics capacity with low power dissipation and an excellent price/performance ratio.
Yes, to AI functions in cars – but no to extra charges
Where and how much is the AI revolution changing the automotive industry? An international mobility study by MHP management and IT consultancy gives an overview, supplies current facts and figures, and provides recommendations for action for decision-makers.
Yokogawa power meter underpins VDE system
Yokogawa’s power meter underpins VDE system for ensuring accuracy of electric vehicle charging points.
Renesas’ new RA8 Entry-Line MCU groups
Renesas has introduced the RA8E1 and RA8E2 microcontroller (MCU) groups, extending its most powerful series of MCUs.
Reducing R&D battery testing times by 98% using AI
camLine and theion have announced their collaboration to implement AI-driven solutions that will accelerate the development of advanced battery technologies worldwide, revolutionising the way battery manufacturers transition from lab-scale to mass production.
Compact T-modules replace mechanical relays
OMRON has expanded its range of T-modules to support accurate measurements in all types of test equipment.
Advanced Energy & Sager Electronics power supply initiative
Advanced Energy has announced a joint initiative with distribution partner Sager Electronics that will speed the delivery of fully configured, modular power supplies for design and testing.
Laser- and photodiodes DIE bonding in optoelectronics
In the dynamic world of optoelectronics, where light and electronics come together, connection technology plays a crucial role in the performance and lifespan of laser diodes (LD) and photodiodes (PD). Tresky is offering customised solutions that are specially tailored to the requirements of DIE bonding of laser- and photodiodes.
Performance boost for AI inference in the low-power range
For the first time, Intel Core i processors with up to eight E-cores are now available on SMARC Computer-on-Modules. This allows even the smallest fanless low-power systems for extended temperature ranges to benefit from extremely powerful AI inference logic and enhanced virtualisation options, improving cyber security among other advantages.
Webinar by Texas Instruments
Join the webinar to learn how TI can help simplify and expedite your design process and transition to USB-C with their unmatched products, technical expertise and design resources for industrial and automotive applications.