Morgan Develops Capability For High Permittivity Substrates For High Frequency Circuits And Antenna Applications
In response to demands for miniaturisation, Morgan Advanced Materials has further developed manufacturing capabilities using temperature stabilised dielectric materials with high permittivity for advanced substrate applications.
The substrates, designed for use in high frequency circuit applications have been developed using Morgan’s proprietary ceramic compositions in the permittivity ranges from 20 to 80. The substrates are of high sintered density and offer superb electrical characteristics which can be specifically tuned in their temperature response to frequency or capacitance to further stabilise the design, dependant on sufficient volume demand.
Typical applications include high frequency substrate designs for medical and electrical circuits as well as for custom RFID antenna and other antenna designs.
Various combinations can be made available with custom tooling up to 150mm square and down to 0.25mm thick.
Paul Turnbull, Business Development Manager at Morgan Advanced Materials commented, "Our philosophy is to push the boundaries in the manufacture of demanding components and to support the next generation of substrate materials – most current solutions are based on lower permittivity alumina or polymeric based solutions which offer much lower effective permittivity or dielectric constant and cannot be easily temperature stabilised to provide optimum performance. The solutions offered by Morgan include non- magnetic options making them ideal for some medical applications and an effective permittivity of up to 8 times that available with alumina. The materials are designed with exceptionally low electrical loss or high electrical Q over a range of frequencies and temperatures. An additional benefit is that our materials know-how enables us to modify the electrical responses with temperature variation to optimise overall performance”.
The substrate materials are currently also available with a range of metallisation treatments subject to end application.