Application Notes
AN-1125 Laminate CSP/FBGA (Rev. E)
Texas Instruments
Published : 03 May 13
Description
Laminate substrate based CSPs at TI have been in production for over three years. Texas Instrumentshas shipped over 300 millions units of the CSP to the wireless industry and has offered both the land gridarray (LGA) as well as the fine pitch ball grid array (FBGA) for the CSP. This is the package choice forportable and wireless applications.
Application Note
Download application note for AN-1125 Laminate CSP/FBGA (Rev. E) by Texas Instruments
Application Note
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