Application Notes
AN-1412 Micro SMDxt Wafer Level Chip Scale Package (Rev. K)
Texas Instruments
Published : 23 Apr 13
Description
Micro SMDxt is a wafer level CSP (WLCSP) with the following features:
- Package size equal to die size
- Smallest footprint per I/O count
- No need for underfill material
- Interconnect layout available in 0.4 mm or 0.5 mm pitch
- No interposer between the silicon IC and the printed circuit board
Application Note
Download application note for AN-1412 Micro SMDxt Wafer Level Chip Scale Package (Rev. K) by Texas Instruments
Application Note
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