Application Notes
56-Pin Quad Flatpack No-Lead Logic Package
Texas Instruments
Published : 07 Feb 03
Description
Texas Instruments (TI) Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220 allows for board miniaturization and holds several advantages over traditional SOIC TQFP TSSOP and TVSOP packaging. This package designated RGQ by TI physically is smaller than traditional leaded solutions has a smaller routing area improved thermal performance and improved electric
Parts
Part Number
Name
Companion Part
Application Note
Download application note for 56-Pin Quad Flatpack No-Lead Logic Package by Texas Instruments
Application Note
Featured products
| Manufacturer: | Texas Instruments |
|---|---|
| Part Family: | DP83TC811-Q1 |
| Status: | ACTIVE |
| ROHS: | Y |
| PB Free: | Y |
| Manufacturer: | Texas Instruments |
|---|---|
| Part Family: | UCC15240-Q1 |
| Status: | ACTIVE |
| ROHS: | Y |
| PB Free: | Y |
| Manufacturer: | Texas Instruments |
|---|---|
| Part Family: | TMP1827 |
| Status: | ACTIVE |
| ROHS: | Y |
| PB Free: | Y |
| Manufacturer: | Texas Instruments |
|---|---|
| Part Family: | SN74AHC1G02-Q1 |
| Status: | ACTIVE |
| ROHS: | Y |
| PB Free: | Y |
| Manufacturer: | Texas Instruments |
|---|---|
| Part Family: | DLP301S |
| Status: | ACTIVE |
| ROHS: | Y |
| PB Free: | Y |
| Manufacturer: | Texas Instruments |
|---|---|
| Part Family: | TMUXHS221LV |
| Status: | ACTIVE |
| ROHS: | Y |
| PB Free: | Y |
