Wave Solder Exposure of SMT Packages
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Application Notes

Wave Solder Exposure of SMT Packages

Texas Instruments

Published : 09 Sep 08
Application Notes
Description
It is common practice to attach surface mount components to the underside of a printed circuit board (PCB) by processing the PCB through a wave soldering operation after gluing the components to the PCB. This paper ummarizes results of several tests performed to understand the performance of surface mount components when exposed to the conditions outlined in JESD22A111.

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Application Note
Download application note for Wave Solder Exposure of SMT Packages by Texas Instruments
Application Note

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