Power
Vishay Siliconix Extends P-Channel TrenchFET Gen III Technology to Dual 12-V Power MOSFET; New Device Lowers On-Resistance Up to 32 % in 2-mm by 2-mm Footprint Area
Vishay Intertechnology introduced a new dual 12-V p-channel TrenchFET Gen III power MOSFET with the lowest on-resistance ever achieved for a dual p-channel device in the thermally enhanced PowerPAK® SC-70 2-mm by 2-mm footprint area.
WithFor these devices, the lower on-resistance of the SiA975DJ translates into lower conduction losses, allowing the device to perform switching tasks with less power than any previous dual p-channel power MOSFETs on the market in ultra-small packages, thus prolonging battery life between charges. The MOSFET’s low on-resistance also means a lower voltage drop at peak currents to better prevent undervoltage lockout conditions with the IC/load. Alternatively, the designer may be able to use a lower-voltage battery.
The SiA975DJ offers an ultra-low on-resistance of 41 mΩ at 4.5 V, 60 mΩ at 2.5 V, and 110 mΩ at 1.8 V. The closest competing 20-V p-channel device with an 8-V gate-to-source rating features an on-resistance of 60 mΩ at a 4.5-V gate drive and 80 mΩ at 2.5 V. These values are 32 % and 25 % higher, respectively, than the SiA975DJ.
The compact 2-mm by 2-mm footprint of the SiA975DJ’s PowerPAK SC-70 package is half the size of the TSOP-6, while offering comparable on-resistance. 100 % Rg tested, the MOSFET is halogen free in accordance with IEC 61249-2-21 and compliant to RoHS directive 2002/95/EC.