PCIM 2014: Smart gate driver photocoupler monitors IGBT modules
Delivering the ability to monitor IGBT modules to prevent problems rather than react to an incident is a theme at this year’s PCIM exhibition in Nuremberg. Toshiba Electronics Europe (TEE) contribution to meet this demand is a smart gate driver photocoupler with 4A (max) output current housed in a thin SO16L package for use in driving medium-power IGBTs and power MOSFETs.
The TLP5214 has a number of advanced integrated functions including IGBT desaturation detection, active miller clamping, soft IGBT turn-off, undervoltage lockout (UVLO) and fault detection, which help prevent the IGBT from reaching overcurrent condition.
By having the ability to detect and handle malfunction in a single chip, TLP5214 helps reduce overall system cost. The SO16L package guarantees a creepage distance of 8mm (min), ideal for applications that require higher isolation specifications. It has the additional benefit of being only 2.3mm (max) in height.
Combined with the high-reliability infrared LED, TLP5214 is ideal for a wide range of applications, including those that require high thermo-stability, such as factory automation, home photovoltaic power systems, digital home appliances and UPS. Maximum propagation delay time 150ns and propagation delay skew ±80ns are guaranteed within the defined operation temperature range (up to 110 degrees C), making it possible to reduce dead time in the inverter circuit, which can secure higher operating efficiency.
Other electrical characteristics are output supply voltage 15~30V; supply current 3.5mA (max); and threshold input current 6mA (max). Isolation voltage is 5000 Vrms (min).
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