TI's breakthrough in high-density power solutions for point-of-load design

“Point-of-load designs require greater power density, high efficiency and ease of use,” said Sami Kiriaki, senior vice president of TI’s Power Management business. “These two new power devices achieve new levels of integration and performance, and allow us to support a wide range of customers in portable, telecom, base station and industrial markets like never before.”

Smallest integrated 600-mA solution

The TPS82671 is the industry’s smallest integrated plug-in power solution at 6.7 mm2, providing 90 milliamps per square millimeter. The device combines all external components in TI’s new MicroSiP™ package with a 1-mm height -- easing design for 600-mA portable electronics, such as smartphones. The TPS82671 operates at a very low 17-uA quiescent current and achieves power efficiency of greater than 90 percent from an input voltage of 2.3 V to 4.8 V. A unique PWM frequency dithering feature reduces noise and improves performance in radio frequency-sensitive designs

Ultra-dense point-of-load

TI’s new 6-A, 14.5-V TPS84620 achieves a power density of greater than 800 watts per cubic inch with up to 95 percent efficiency and 30 percent better thermal dissipation than competitors. The integrated step-down solution combines the inductor and passives onto one device, and requires only three external components, resulting in a complete solution in a space less than 200 mm2. The TPS84620 supports a variety of high-power telecom infrastructure and industrial systems that use DSPs and FPGAs.

Broadest range of point-of-load solutions

TI offers the broadest range of power management ICs for non-isolated point-of-load designs, including step-up and step-down converters for portable and line-powered systems. These range from ultra-low power DC/DC converters with and without integrated FETs to fully integrated power solutions to plug-in power modules.