Three new miniature packages for Automotive MOSFETs

13th November 2013

Toshiba

Nat Bowers

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Toshiba announce an expansion of its automotive power MOSFETs portfolio with three new miniature package formats. Helping designers make significant PCB space savings without compromising performance, Toshiba’s SOP-Advance packages are ideal for mid-power applications where DPAK devices are conventionally used. TSON Advance and PS-8 package formats can replace SOP-8 devices and save board space.

The TPCA8xxx, TPCC8xxx and TPCP8xxx series of MOSFETs offer N-channel and P-channel variants and are provided in SOP Advance, TSON Advance and PS-8 package formats respectively. Featuring low on resistance and low input capacitance, the MOSFETs have respective dimensions of 5.0 mm x 6.0 mm x 0.95 mm; 3.3 mm x 3.3 mm x 0.85 mm and 2.8 mm x 2.9 mm x 0.8 mm. The new 175°C rated devices offer low conduction and switching power loss. SOP Advance and TSON Advance packages have bottom-side metal heat slugs to conduct heat better than conventional miniature packages, such as SOP-8.

The new TPCA8xxx SOP-Advance MOSFETs offer voltage and current ratings up to +60V and 40A for N-channel devices and -60V and -35A for P-channel devices. The TPCC8xxx TSON Advance series features voltages and currents to +60V/-60V and +30/-30A. TPCP8xxx N-channel PS-8 MOSFETs can be supplied as single-channel devices with ratings to +60V and 10A or in a dual-channel version rated to 40V and 5A. P-channel TPCP8xxx MOSFETs are available for voltages and currents up to -60V and -8A.

Toshiba can also supply a PS-8 packaged device that combines a 40V, 5A N-channel MOSFET and a -40V, -4A P-channel MOSFET in the same ultra-miniature package.