Solderable top side improves power cycling capabilities

The improved top metallization also enables the use of a sintering bonding process for the IGBTs, which provide a solderless structure, free of thermal fatigue and better thermal conductivity. Further to this, the top side soldering gives the benefit of top side cooling and better surface lateral high current flow uniformity, thus enabling higher power outputs with less “hot spots” and less “current hogging”.

“The solderable topside enables the module designer to create low inductive designs which has increasing interested for these high power and high speed devices,” said IXYS's Jeroen van Zeeland. “Improved surface thermal conductance, reduced series resistance and better thermal cycling come with improved switching performance, a benefit that our customers for dies and modules are getting.”

Since the top side soldering processes has been used for decades in the IXYS bipolar power module products, introducing solderable top side Trench XPT IGBTs is a natural evolution for IXYS.

These new IGBT products fit the high current applications for IGBTs in motor control, inverters, automotive and transportation, UPS, welding, and other high current Industrial applications.

First available products are the IX112T06M-AG, a 650V 200A Trench XPTTM IGBT, and the IX150T06M-AG, a 650V 300A Trench XPTTM IGBT. These new IGBT dies and the counterpart Free Wheeling diodes are based on SONIC technology and are available in production quantities.