The FSAM50SM60A (600V/50A) and FSAM75SM60A (600V/75A) modules in 60 x 31mm dual inline packages (DIP) occupy virtually half the board space of discrete solutions. Utilizing direct bonded copper (DBC) substrate technology, SPM packages provide excellent thermal resistance and heat transfer capability. These 50/75A Motion-SPM devices offer designers a highly integrated, simplified approach to applications requiring higher efficiency and performance characteristics such as air conditioners and servo drivers used in factory automation.

Fairchild's new Motion-SPM products enable designers to easily upgrade 1kW-rated applications to 7.5kW simply by selecting a different SPM device in the same ultra-compact DIP package. By using thermally optimized DBC technology, Fairchild was able to develop all 10A to 75A modules in one 60 x 31mm package outline. This gives designers the ability to use significantly less board space than discrete solutions and the flexibility to simplify their designs, said Taehoon Kim, vice president of Fairchild's Functional Power Group.

To eliminate external components and increase system reliability, each Motion-SPM integrates six IGBTs, six freewheeling diodes, three HVICs, one LVIC and one thermistor in one compact module. The built-in HVICs provide a single-grounded power supply for optocoupler-less interface, which reduces component count, while the low-side sense IGBTs provide adjustable short-circuit current protection. Each module also offers integrated sensorless control and temperature monitoring and an integrated thermistor monitors over-temperature conditions, further increasing system reliability. In addition, Motion-SPM devices enhance power efficiency by providing switching frequencies up to 20kHz and a 2500Vrms/min isolation voltage rating.

The FSAM50SM60A and FSAM75SM60A are lead (Pb)-free products that meet or exceed the requirements of the joint IPC/JEDEC standard J-STD-020C and are compliant with the European Union requirements now in effect.