Power modules lower production costs & increase reliability

14th January 2016

Vishay

Nat Bowers

0 0

Datasheet

Designed for welding machines, UPS, switch mode power supplies and motor drives, Vishay Intertechnology has introduced a series of 45 to 100A three-phase-bridge power modules in the low-profile MTP PressFit package. Compared to devices incorporating solder contact technology, the VS-40MT160P-P, VS-70MT160P-P and VS-100MT160P-P dramatically lower production costs and increase reliability.

The solderless PressFit technology of the power modules allows for easy one-step PCB mounting to significantly reduce assembly time while simplifying in-field maintenance. Offering direct mounting to heatsinks, the devices' low 17mm profile maximises space savings while optimising electrical layouts for application-specific power supplies.

Providing higher reliability and long-term durability compared with solder contact technology, the power modules' PressFit package offers increased resistance to shock and vibration while eliminating issues such as cold spots, voids, splatter and cracks. In addition, the devices are not subject to solder fatigue, a common failure mechanism in power modules operating at high temperatures.

Optimised for AC/DC input rectification, the 45A VS-40MT160P-P, 75A VS-70MT160P-P and 100A VS-100MT160P-P offer 3500Vrms insulation voltage, low forward voltage and low junction-to-case thermal resistance. Designed and qualified for industrial-level applications, the RoHS-compliant devices are UL-approved, file E78996.

Samples and production quantities of the power modules are available now, with lead times of 8 to 10 weeks for large orders.