Point-of-load DC-DC converter offers a wide range of flexibility

Rather than using side by side discrete Integrated Circuit (IC) and discrete inductor (L) the new FS series integrates the IC and inductor in a compact configuration which offers a high density solution for space-constrained applications requiring a low profile power source. 

At 3.3x3.3x1.5mm, they minimise the required external components, retaining the highest possible performance while offering a simplified design for ease of integration.

This family can deliver a high density solution of 1W per mm3, while offering 50% less solution size than the other products available in its class. As a result, this minimises system solution cost, reduces board size and assembly costs, as well as BOM and PCB costs. It operates at a broad junction temperature range, from -40 °C to 125 °C. Mass production of FS1406 is expected to begin in Q3 2019.

TDK has been developing patents related to these innovations (US 9,729,059 and US 10,193,442) over several years. µPOL were developed by TDK’s group company Faraday Semi. These new solutions incorporate high performance semiconductors in advanced packaging technologies such as semiconductor embedded in substrate (SESUB) and advanced electronic components to achieve system integration in a smaller size and lower profile by 3D integration.

This integration allows TDK to deliver higher efficiency and ease of use at a lower total system cost to what is currently available today.

μPOL technology includes a DC-DC converter placed in the vicinity of complex chipsets such as ASICs, FPGAs and others. By minimising the distance between the converter and the chipset, the resistance and the inductance components are minimised, allowing fast response and accurate regulation with load currents.

The product family is rated for industrial application, is lead free and has ROHS compliance.

TDK will be showcasing its µPOL technology at APEC 2019 from 18th-20th March at the Anaheim Convention Center in Anaheim, CA at booth 811.