Modules fulfil single, dual or multi-chip die design demands

These low-cost devices are supplied with an electrically isolated copper (99% purity, C10200) baseplate and aluminum nitride (AIN) or Alumina substrate to ensure isolation at 3,000 Vrms, with very low thermal resistance. Moreover, the baseplate is exposed to allow direct mounting to the heatsink, therefore meeting the industry standard for safety.

Featuring a low inductance design, America Semiconductor's SOT-227 standard power packages are ideally suited for a range of industrial applications in which an ultra high power density and low profile isolated case is required. The modules are commonly used in power transistor, rectifier and thyristor applications, and are commonly specified for employment in uninterrupted power supplies (UPS), elevators, escalators, welding and induction heating, motor controls, variable speed drives, switch mode power supplies, robotics, and telecom equipment.

The SOT-227 supports a thermal resistance of 40° C/W (junction-to-ambient) and 0.18 to 0.6° C/W (junction-to-case) along with power dissipation of 110 to 700 W. The module features wire-bonded internal connections and screwable electrical terminals to prevent axial pull-outs and further ensure reliable performance.