Intersil releases samples of 10A, highly integrated power module

It simplifies power supply design as only input and output capacitors and a resistor is needed to implement a complete power solution. This small form factor saves considerable board space while the high integration reduces procurement and placement costs in various applications such as telecommunication, data communication, electronic data processing, wireless network systems, medical & instrumentation and distributed bus architecture based point of load applications. Also, an onboard input filter supports an ultra-low noise operation thus reducing EMI.

The ISL8201M achieves up to 93percent efficiency and excellent thermal performance due to the QFN package that is designed to offer an optimum heat transfer through the PCB. A large copper plate under the package allows the ISL8201M to achieve a power density of approximately 200W/in3, roughly four times that of conventional open-frame modules thereby eliminating the need for heat sinks. Other features include internal soft-start, auto-recovery overcurrent protection, ENABLE pin option and pre-biased output start-up capability.

The high integration and performance of the ISL8201M is housed into a tiny 15mm x 15mm x 3.5mm QFN package