Integrated solutions for industrial motor drives

The new NXH50M65L4C2SG and NXH50M65L4C2ESG are transfer−molded power integrated modules (TMPIM) based upon standard aluminum oxide (AI2O3) substrate and enhanced low thermal resistance substrate respectively. Suited to rugged industrial applications with high output power, the modules contain a converter−inverter−PFC circuit consisting of single-phase converter with four 75A, 1,600V rectifiers.

The three-phase inverter uses six 50A, 600V IGBTs with inverse diodes and the dual−channel interleaved PFC comprises two 75A, 650V PFC IGBTs with inverse diodes and two 50A, 650V PFC diodes. An NTC thermistor is embedded to allow for monitoring of device temperature during operation.

As the module is pre-assembled in an optimised layout and configuration, parasitic elements are very small when compared with discrete PCB-based designs, thereby allowing a wide PFC switching frequency range between 18 and 65kHz. The highly efficient NXH50M65L4C2SG and NXH50M65L4C2ESG are rated at 50A permitting use in applications up to 8 kW, and are the latest devices in the ON Semiconductor TMPIM family. Other devices are available with current ratings of 20 A and 30A.

The compact transfer-molded DIP-26 package measures just 73x47x8mm – a 20% area savings over current solutions that enables higher levels of power density. The sealed and robust package includes an integrated heatsink (with 6 mm clearance to pins) and offers high levels of corrosion resistance.

A silicon carbide (SiC) option is also available for further increased switching frequency and efficiency.

The new NXH50M65L4C2SG and NXH50M65L4C2ESG work alongside the FAN9672 PFC controller and gate driver solutions including devices in the new NCD5700x family. The recently introduced NCD57252 dual channel isolated IGBT/MOSFET gate driver offers 5kV of galvanic isolation and can be configured for dual low-side, dual high-side or half-bridge operation.

The NCD57252 is housed in a small SOIC-16 wide body package and accepts logic level inputs (3.3, 5 and 15V). The high current device (source 4.0A / sink 6.0A at Miller plateau voltage) is suitable for high-speed operation as typical propagation delays are 60ns.

Driving motors in the most efficient way is key to simplifying installation, lowering heat build-up, enhancing reliability as well as reducing system costs. The ON Semiconductor TM-PIM devices standardise the pinout with minimised parasitic to give designers a high performance ‘plug and play’ solution. Coupling the NXH50M65L4C2SG and NXH50M65L4C2ESG with FAN9672 and NCD57252