IGBTs boast SoLid Cover) technology in low-profile package
A family of power IGBTs in the new VINco E3 package from Vincotech are available at Richardson RFPD with full design support capabilities. The VINco E3 package features SLC (SoLid Cover) technology in an industry-standard low-profile package. It enables engineers to design mid-power inverters with higher output current, higher power density and improved reliability for motion control, industrial drives, solar power, UPS and other mid-power applications.
The insulated metal baseplate combines an electrically-insulating resin layer with direct-bonded top- and bottom-side copper layers.
It replaces the substrate solder layer and separate baseplate to achieve high thermal cycling capability, reduced thermal resistance, and high power density and low stray inductance.
Direct potting resin distributes the mechanical stress more uniformly than silicone gel for improved power cycling capability.
The first VINco E3 releases are equipped with the latest low-loss Mitsubishi Gen 7 chips.
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