Hybrid digital power modules offer efficiency for advanced FPGAs

Also announced are the new ISL8210M and ISL8212M analogue power modules, offered in the same pin-to-pin compatible 12x11mm package with 10 and 15A of output current, respectively.

The hybrid digital and analogue power modules provide Point-of-Load (POL) conversion for advanced FPGAs, DSPs, ASICs and memory used in servers, storage, optical networking, telecom, and a broad range of space-constrained industrial applications.

Each device integrates a PWM controller, MOSFETs, and inductor inside a new thermally optimised, Grid High Density Array (GHDA) encapsulated module. To complete the power supply, designers simply add input and output ceramic capacitors.

The ISL828xM hybrid digital and ISL821xM analogue power modules feature integrated LDOs that enable single-supply operation. They leverage Renesas’ patented R4 high speed control loop architecture with inherent line voltage feed-forward, providing designers a combination of ultra-fast load transient response and high noise immunity.

Their proprietary Grid HDA package offers unmatched electrical and thermal performance through a single-layer conductive package substrate that efficiently transfers heat from the module to the system board, and dissipates it without requiring airflow or heatsinks - even under heavy load conditions.

“Our newest power modules expand Renesas’ growing portfolio, adding new capabilities to our performance analogue module family and bridging the gap between them and our full digital power modules,” said Philip Chesley, Vice President, Industrial Analog and Power Business Division, Renesas Electronics.

“The new hybrid digital power modules offer class-leading power density and efficiency not achievable with discrete components. Compared to competitors’ module designs, the new Grid HDA package makes it easier for customers to mount the module on their circuit board.”