eGaN FETs enable DC/DC solutions for ultra-thin, high-density computing

The EPC9148 utilises a multilevel topology enabling a maximum component height less than 4mm, while maintaining a 98% peak efficiency.

Both solutions integrate Microchip Technology’s dsPIC33CK digital signal controller (DSC) with the latest generation 100V eGaN FETs from EPC.  These solutions achieve greater than 98% efficiency at 12.5A in an ultra-thin footprint.  The flexibility of the Microchip digital controller allows the input voltage of these boards to be adjusted from 44 to 60V and the output voltage from five to 20V.

The EPC9148 multilevel converter reducing the size of modules supporting magnetic components, while achieving high efficiency in a compact solution. One of the highlights on the EPC9148 board is a custom extremely thin power inductor from Würth Elektronik, which helps to enable the ultra-high power density of this design.

The EPC9153 offers a simple, low-cost synchronous buck configuration that keeps the maximum component height low, achieves 98.2% peak efficiency, with less than 40°C temperature rise at 20 V output. eGaN FETs improve the overall efficiency with their fast switching capability and their chip-scale footprint make it easy to cool in an effort to achieve the low temperature rise required for these compact designs.

“Computers, displays, smart phones, and other consumer electronics systems continue to become thinner and more powerful,” said Michael de Rooij, EPC’s Vice President of Applications Engineering. “We are thrilled to work with partners such as Microchip Technology and Würth Elektronik to develop ultra-thin and highly efficient solutions to address the challenge of getting more power out of limited space and volume.”