Compressible TIM guarantees thermal stability up to 400°C

Thermal Interface Material (TIM) is a key component in the majority of power electronic systems. Heat generated by semiconductors, has to be transferred to a heat sink and ultimately dissipated. Soft-PGS is a 200µm thick graphite sheet designed for use as a thermal interface material for IGBT modules. As Soft-PGS can be compressed by 40% it is a way to reduce thermal resistance between a heat sink and an IGBT module. The 200µm thick Soft-PGS sheet is easy to install, and has far lower labour and installation costs than thermal grease or phase change material. Soft-PGS guarantees thermo stability of up to 400°C and high reliability against intense heat cycles (-55 to 150°C). Its thermal conductivity is guaranteed at 400W/mK for X-Y direction and at 30W/mK in Z direction. Panasonic offers a range of standard sheets for different IGBT modules from various suppliers.

Simone Saile, Product Manager, Thermal Solutions & Ceramic Devices, Panasonic, commented: “Reducing the volume of the heat sink combined with increased local power densities leads to greater demands on the thermal interface connecting power electronic components to the heat sink. A paste-like TIM-layer below a module is never of homogenous thickness and additionally, most paste-like thermal solutions also degrade and age over time. Compared to thermal grease and PCM, Soft-PGS fits uneven surfaces far better as well as offering superior workability, reliability and thermo stability.”