Compact power module delivers excellent thermal performance

23rd November 2016

Mick Elliott

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Datasheet

The STK984-190-E Power Integrated Module (PIM) from ON Semiconductor is in stock at Mouser Electronics. Optimised for driving three-phase brushless DC (BLDC) motors in automotive applications, the module’s seven MOSFETs are mounted onto a direct bonded copper (DBC) substrate, resulting in a compact module with excellent thermal performance taking up only half of the board space used by an equivalent discrete solution.

The Power Integrated Module contains six AEC-Q101 qualified 40V, 30A MOSFETs configured as a three-phase bridge with an additional 40V, 30A high-side reverse battery protection MOSFET.

The module’s DBC substrate reduces thermal resistance, which lowers the operating temperature of the MOSFETs and decreases power losses while increasing reliability due to a limited change in temperature during thermal cycling.

Reliability is also improved by the isolation provided by the DBC substrate.

Designers can combine the STK984-190-E module with motor controllers to build high-efficiency BLDC solutions with best-in-class thermal performance, built-in diagnostics, and an ultra-small PCB that saves critical size and weight.

The module is supported by the STK984-190-EGEVB evaluation board, and is suitable for use in 12V automotive electric motor drive applications with power ratings up to 300W, such as electric pumps, fans, and windscreen wipers.