AMD extends the UltraScale+ product portfolio

The new AU7P and ZU3T devices are based on the 16nm FinFET process for low power, high performance-per-watt, and small form factor applications. These small, low cost, and low power entry points to the programmable logic (PL) transceiver-based UltraScale+ family offer improved features such as high IO-to-logic density, UltraRAM, DSP, etc.

The new Artix UltraScale+ AU7P FPGA

The AU7P device is the lowest density, lowest power, and most cost-optimised 12.5Gbps transceiver-based FPGA in the Artix UltraScale+ portfolio. It offers high I/O-to-logic ratio and high memory-to-logic ratio for storing and buffering large amounts of data for processing and compute applications.

The new device provides up to 50% lower static power, 20% more I/O-to-logic ratio, and twice as many 3.3V HDIO compared to the AU10P device.

The AU7P device is suited to applications requiring high compute density in a small footprint due to the innovative InFO packaging with 8.5mm x 10.5mm dimensions, which provides thermal and power distribution. InFO packaging, which continues to gain prominence in the industry, is designed for compact, power-sensitive applications such as medical imaging, machine vision, professional cameras/monitors, and automotive radar/lidar.

New Zynq UltraScale+ ZU3T MPSoC

The ZU3T MPSoC device is the smallest device added to the Zynq UltraScale+ family with 12.5Gbps GTH transceivers for cost-optimised applications. The GTH transceivers are configurable and tightly integrated with programmable logic resources of the UltraScale+ architecture. The ZU3T device also has 5X the transceiver bandwidth compared to the ZU3 device for critical networking applications, vision and video processing, and secured connectivity.

The new device has higher DSP slice count compared to ZU3 for better signal processing compute. The additional UltraRAM adds 2.5X the embedded memory for embedded and video processing applications.

As part of the Zynq MPSoC family, the ZU3T device contains a 64-bit processor combining real-time control with soft and hard engines for graphics processing. The integration of both an Arm-based CPU sub-system for advanced analytics and on-chip programmable logic for task acceleration creates new possibilities for optimising a broad range of applications, including smart cities, camera monitors, medical imaging, and automotive infotainment.

The AU7P device is expected to begin shipping pre-production and production silicon in the second half of 2023.The ZU3T device is expected to begin shipping pre-production silicon to early access customers in the first half of 2023, with production silicon expected in the second half of 2023.

AU7P and ZU3T devices will be available in automotive (XA) grade, qualified according to AEC-Q100 test specifications with full ISO26262 ASIL-C level certification. This scalable solution is ideally suited for various automotive customer platforms by delivering the right performance/watt while integrating critical functional safety and security features.