Power

Alpha and Omega Semiconductor expand surface mount and module package options

7th June 2024
Paige West
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Alpha and Omega Semiconductor Limited (AOS) announce the expansion of its package portfolio options for the second generation 650 to 1200V αSiC MOSFETs.

Applicable to critical applications such as xEV charging, solar inverters, and industrial power supplies, the new package selections offer designers added flexibility for system optimisation and streamlined manufacturing processes. AOS will showcase its expanded surface mount and module package options at PCIM Europe 2024 in Nuremberg, Germany, from 11th to 13th June.

The first new surface mount package is available for the AOBB040V120X2Q, AOS’ new 1200V/40mOhm αSiC MOSFET in a standard D2PAK-7L surface mount package. This AEC-Q101 qualified product is designed to replace traditional through-hole packages and is ideal for applications such as on-board chargers (OBCs), where efficient cooling can be provided by vias and backside PCB heatsinks. This simplifies the assembly flow and maximises power density. Additionally, the low inductance package combined with the fast driver source-sense connection positions these AOS αSiC MOSFETs as one of the most efficient power-switching solutions in the market.

For additional design flexibility, AOS is releasing its GTPAK surface mount package with topside cooling features. In designs where a topside-mounted heatsink is viable, the direct heat path from the GTPAK minimises thermal resistance and enables higher power dissipation for more effective PCB routing. The first AOS product in GTPAK is the AOGT020V120X2, a 1200V/20mOhm αSiC MOSFET, ideal for high-efficiency solar inverter and industrial power supply applications.

Finally, AOS announces the AOH010V120AM2 as the first product in its new AlphaModule high-power baseplate-less module family. This 1200V/10mOhm half-bridge αSiC module features press-fit pins and an integrated thermistor. It is in a standard footprint module that enables the replacement of multiple discrete devices into a single compact form factor while simplifying both the mechanical and electrical design by providing a clear separation of electrical and cooling paths. Single modules are suitable for residential solar inverters, or several modules in parallel will allow scaling to power levels necessary to drive the needs of fast DC charging stations.

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