650V SiC Schottky diodes suit PFC & power conversion

The diodes feature zero reverse recovery current, high frequency operation with low EMI, temperature-independent switching behavior, reduced heat sink requirements and high surge and avalanche capabilities. Cree says that the Z-Rec also exhibits higher efficiency than comparable silicon diodes, with essentially no switching losses, and a positive temperature coefficient on VF enables parallel devices without thermal runaway.

Designed to satisfy power systems engineers’ need for higher current in a more compact, surface mount package, the 650V 6A C3D06065E, 8A C3D08065E, and 10A C3D10065E Z-Rec diodes are supplied in small-footprint TO-252-2 (DPAK) packages.

Exhibiting extremely fast switching, these 650V devices enable correct sizing of the diode, optimising both cost and performance in switch mode power supplies, PFC and motor drives, amongst other applications. They may also negate the need for through-hole SiC Schottky diode assembly, as well as enable smaller final assembly dimensions for 650V designs.

Automotive qualification makes the diodes suitable for use in EVs and HEVs, for PFC and onboard power electronic conversion systems such as chargers, dc/dc converters & inverters. In order to maintain a fair, competitive offering, Cree offers automotive qualification at no extra cost for around 90% of its diode portfolio.

A complete list of Cree’s automotive qualified diodes - available in five plastic package types, two voltage ratings (600V and 650V), and with current ratings spanning 2 to 20A - can be found on the Cree Power website. The fourth 650V diode, Cree’s 6A, 650V C3D06065I internally isolated Z-Rec Schottky diode is an alternative to full-pack diodes and a complement to the existing 8A C3D08065I and 10A C3D10065I.

Featuring a TO-220 package with internal ceramic insulation that provides 2.5kV isolation, Cree’s 6A, 650V internally isolated diode also provides large operating ranges and capabilities, including high maximum temperatures and power dissipation. Additionally, by eliminating the need to insert an external isolating sheet between the diode and heat sink, this diode eases design, reduces cost, and supports the efficient manufacturing of HVAC, PFC, and switch mode power supplies.