10A highly integrated power module features PWM, drivers, MOSFETs and inductor in a tiny QFN package

This small form factor saves considerable board space while the high integration reduces procurement and placement costs in various applications such as telecommunication, data communication, electronic data processing, wireless network systems, medical and instrumentation, and point-of-load applications based on a distributed-bus architecture. Also, an onboard input filter supports ultra-low noise operation thus reducing EMI.

The ISL8201M is capable of delivering 10A (17A peak) output current with up to 95% efficiency, without the need for heat sinks or airflow to meet power specifications. Other features include internal compensation, internal soft-start, auto-recovery overcurrent protection, an enable option, and pre-biased output start-up capability.

The high integration and performance of the ISL8201M is housed in a tiny 15x15x3.5mm QFN package that is designed to offer optimum heat transfer through the PCB for excellent thermal performance. A large copper plate under the package allows the ISL8201M to achieve a power density of approximately 200W/in3, roughly four times that of conventional open-frame modules, thereby eliminating the need for heat sinks. The QFN package improves adherence to the PCB and improves overall reliability of end products. Additionally, all functional pins are brought out on the sides to make probing and debugging easier.

The ISL8201M is available in a 15-lead QFN package.