VJ Electronix, Inc. to Showcase Leading Rework and X-ray Solutions at IPC APEX EXPO 2011

The SRT Micra is a brand new SRT rework platform in a benchtop format that is specifically designed for the rework of mobile products incorporating small, high density electronic devices such as Smartphones, Netbooks, GPS and other handheld products. The new SierraMate V9 software simplifies process definition and assures consistent, repeatable results between facilities and even continents. The systems’ redesigned heaters and revolutionary power controls provide extremely high throughput and unmatched results, regardless of typical facility voltage variations.

The Micra offers an unprecedented Auto-Run feature, a newly developed automated process set-up tool and a virtual process engineer. Auto-Run minimizes rework setup and profiling times. Highly efficient heaters on the Micra minimize rework cycle times and maximize production throughput. The systems’ inherent accuracy and fixed position core (head) easily accommodates tiny electronic device packages, including 01005 micro-passives and 0.3 mm pitch area array devices. The Micra also delivers optimized scavenging and the automated removal of residual solder, including tightly spaced micro-passives, PoP layers, asymmetrical RF Shield patterns and micro-BGA sub-millimeter lands and pitches. Additionally, the Micra provides a complete mobile device rework solution.

The SRT Summit performance rework platform incorporates all of the innovative features that have been developed since the invention of high-level, semi-automatic surface mount and microelectronics rework technology. Extensive field experience and user feedback have resulted in the development of a rework system that more than satisfies current and future industry requirements with its unparalleled up-time and process flexibility.

SierraMateTM software with an intuitive 1-2-3-GO operator interface and Auto Profile maximizes ease of use while maintaining the inherent capability to rework the most complex area-array components (BGAs, micro BGAs, flip chips, CCGA, etc.). The Summit 1800 Rework system provides some of the most advanced features designed specifically to address the most difficult rework challenges, including lead-free rework for large components. The Summit 1800 incorporates independent, programmable motions for both pick-up and top heater height. The pick-up motion enables precise placement force control and zero force removal.

On the X-ray side, VJ Electronix will display and demonstrate X-ray inspection performed by the Vertex A-130 X-ray Inspection system. To meet significant industry challenges, the Vertex Series offers numerous features to help users inspect both electronic and non-electronic assemblies quickly and accurately. A new flexible design allows the platform to be customized for any inspection task. The Vertex Series provides faster load/unload product exchange; highly reproducible results based on repeatability of precision and a programmable control system. Automation of the Vertex allows one operator to run multiple machines. As an added feature, the large board-handling table and large inspection area are ideal for large or multi-up assemblies.

The Vertex’ modular configuration allows customers to select multiple choices of X-ray sources, detectors and motion components, as well as multiple software modules to optimize the system for any application. The NEXUS 300 inspection software allows the operator to perform X-ray inspection and conduct measurements of solder interconnects, typically BGA devices in transmissive mode, while eliminating interference from components beneath the inspection plane. The Masking software increases X-ray inspection efficiency, resulting in higher defect detection, and ultimately producing higher quality products with reduced errors and scrap.