NEC Electronics Two Embedded DRAM Intelligent Buffer ICs for High-Resolution Mobile Graphics Applications

The new SoC solutions integrate 16 megabits (uPD60800) and 30 megabits (uPD60801) of eDRAM memory with graphics processing logic and a high-speed MIPI®-DSI (Mobile Industry Processor Interface – Display Serial Interface) graphics data connection to the host processor. The intelligent buffer integrated circuits (ICs) enable lower power consumption with high resolution and convenient display panel configurations.

For mobile devices that can support consumer demand for higher resolution graphics, the host Digital Base Band LSI or application processor must integrate more memory, increasing the size and cost of the chip. These processors also require a continuous supply of power and memory bandwidth in order to transfer data continuously to the display panel.

By inserting the new devices between the Digital Base Band LSI or application processor and the LCD driver IC, designers can implement new power- and cost-savings strategies while supporting Quarter HD and WSVGA resolution displays. The new devices also address the customer demand for higher data transfer speed by supporting MIPI-DSI interface as well as MDDI interface (uPD60801 only).