Switch targets DSP-intensive processing applications

Tundra Semiconductor has announced the Tundra Tsi574 Serial RapidIO Switch, a high-performance switch with patent-pending technology that delivers the performance, power and configurability, that designers of embedded designs need to build reliable, high-performance RapidIO-based systems for a wide range of applications such as wireless base stations, media gateways, video infrastructure and DSP-intensive image processing.

“The launch of the Tsi574 expands our portfolio of switches to include an optimal offering for DSP aggregation on line cards,” said Rick O’Connor, chief technology officer at Tundra. “As we execute our RapidIO System Interconnect strategy, we will continue to add to the current portfolio to address the full spectrum of features our customers and partners need to design successful RapidIO-based systems.”

Based on the most recent release of the Serial RapidIO Specification v1.3, the Tsi574 Serial RapidIO Switch sets industry benchmarks for high-performance and low power consumption through an innovative feature set supported by world-class design support. Ideally suited for high-performance processor connectivity, the target applications such as media gateways and baseband will benefit from the switch’s ability to route packets to over 64,000 endpoints, independent unicast and multicast routing mechanisms, and error management extensions that provide proactive issue notification to the fabric controller.
This switch interconnects Serial RapidIO-enabled microprocessors, DSPs, FPGAs, and peripheral devices, supporting an aggregate bandwidth of 40 Gb/s. Scalable for a broad spectrum of networking, wireless and video infrastructure applications, designers can take advantage of configuration options to efficiently manage power requirements for high-performance. The Tsi574’s port flexibility supports up to four 4x mode ports or up to eight 1x mode ports, with each port configurable to 1.25 Gb/s, 2.5 Gb/s or 3.125 Gb/s. All of the ports switch of the switch are completely independent, and will support mixed configurations of width and speed.

"When combined with our TMS320TCI6482, the industry's first high-performance RapidIO-enabled DSP, we expect the multicast capability of the Tsi574 Serial RapidIO Switch to enhance performance and simplify system design for wireless applications." said Alan Gatherer, chief technology officer for Texas Instruments Communications Infrastructure and Voice Group. "System designers will benefit from new architectural base station design possibilities by using serial RapidIO enabled products. High-performance, scalable switches, such as the Tsi574, are an essential part of the RapidIO ecosystem."

The Tsi574 integrates several features that allow the switch to leverage the high-performance capabilities of the Serial RapidIO interconnect protocol. The switch has low latency between ports, and each port has optional store and forward or cut-through modes providing peak performance in any configuration. In addition, there is extensive traffic management through three fabric scheduling algorithms and programmable buffer depth for guaranteed bandwidth. Fabric performance monitoring enables supervised and managed traffic flows that result in real-time fabric optimization. The Tsi574 offers low noise core, flip chip packaging, adjustable drive current, adjustable pre-emphasis and receive equalization per lane, which all contribute to the highest possible standards in signal integrity and performance.

“The launch of the Tundra Tsi574 switch signals momentum building behind Tundra’s growing RapidIO product portfolio, which has the depth to respond to a wide spectrum of customers’ needs for the wireless and video markets,” said Jag Bolaria, senior analyst at The Linley Group. ” With multiple RapidIO switches that are scalable for different price/performance points and include advanced capabilities such as hardware multicast, Tundra continues to strengthen its claim as the leader in RapidIO System Interconnect.”

The Tsi574 Serial RapidIO Switch will be sampling in September 2006. Volume pricing for the Tsi574 is under $80 US. The Tsi574 is implemented in 0.13µm CMOS technology, packaged in a 21mm x 21mm, 399-ball FCBGA package. The Tsi574 uses the same package as the Tsi564A™, and the two devices are software compatible. The device requires 1.2V and 3.3V power supplies and is rated for industrial and commercial temperature operation. The switch also supports IEEE 1149.6 JTAG standard for high speed interconnects.