STI Electronics Introduces Alternative to Standard Rigid Arrays

The Micro-Coil Spring Array has been designed to replace the column grid array commonly used on integrated circuits with high lead counts. The Micro-Coil Spring Array was developed by NASA for a higher degree of reliability over conventional column grid arrays and this technology was licensed to STI Electronics, Inc. for its commercialization and production capability.

The Micro-Coil Spring Array is a drop-in replacement for BGA column grid array packaging applications that require greater reliability and long-term robustness. Additionally, it is competitively priced to be lower than column grid array solder columns. Production assembly costs also are lower than for manufacturing the column grid array package.