Samsung Electronics approve ALPHA TetraBond frameless stencil technology

Commenting on the decision to change, Gábor Szabó, Production Director said: “We were very impressed with the rigidity of the stencil foil, the simplicity of the design and the ease of use of ALPHA® TetraBond™, this, coupled with the Alpha teams knowledge on stencil design rules, made the decision to change a fairly straight forward one.”

Gary Cunning, Global Business Manager at Alpha commented: “Samsung are the latest in a long line of major PCB assemblers to recognize the value created by ALPHA® TetraBond™. Since its launch in September 2010, we’ve already surpassed our own expectations of the speed with which this product has had an impact on the market. We are delighted to strengthen our partnership with Samsung with this offering.”

ALPHA® TetraBond™ is the culmination of “frameless” stencil development; an elegantly simple system designed to enhance the rigidity of the stencil foil, making safe mounting and demounting an easier proposition.

Innovatively encompassed in a thin, one piece aluminum extrusion, ALPHA® TetraBond™ stencil foils are designed for use with Tetra foil tensioning frames and are backward compatible with the majority of frames currently in the market, including VectorGuard. They are available with all Alpha Stencil technologies (Alpha® Cut™, Alpha® Form™ and Alpha® Nickel-Cut™) to suit the majority of printer size requirements.