Nihon Superior to Showcase Advanced Soldering Materials at IPC APEX EXPO 2011

SN100C P602 D4 is completely halogen-free, which means there are no intentional additions of the halogens F, Cl, Br or even I hidden in the chemistry. The silver-free SN100C alloy delivers a stable microstructure in an alloy that can accommodate the long-term cyclic strains and impact loading to which a solder joint can be subjected.

The SN100C fillets are smooth and bright with few shrinkage defects and a stable microstructure with minimal growth of the interfacial intermetallic, resulting in highly reliable solder joints. SN100C P602 D4 provides excellent printing and reflow in fine-pitch circuitry, low hot and cold slump, and good coalescence and wetting with no solder balls.

SN100C P603 D4 and SN100C P605 D5/D6 dispensing grade completely halogen-free lead-free solder pastes offer superior dispensing stability, which ensures no skipped pads. SN100C P605 D5/D6 is optimized for high precision dispensing for chip components down to 01005(0402 metric). Being completely halogen-free, these pastes help to achieve improved reliability, high productivity and cost reduction.

SN100C (044) completely halogen-free high performance flux-cored solder wire makes it possible to achieve a high first pass yield because of its excellent wetting and spread, while providing an approximately 30 percent faster soldering speed in manual soldering when compared to the company’s previous halogen-free flux-cored solder wire.

NS-F900 is a robust, heat resistant, no-clean, rosin-based wave soldering flux that is completely halogen-free. It provides high performance with high temperature preheat profiles, allowing high topside board temperatures up to 125°C and the long contact times that may be required for thick boards and dense, complex assemblies while being environmentally friendly. NS-F900 is specifically designed for use with SN100C (Sn-Cu-Ni+Ge) lead-free solder but works well with all lead-free solders as well as Sn/Pb.

NS-F900 has been formulated to provide good hole-fill and easy solder joint inspection with minimal residue, while meeting JIS and J-STD-004 Surface Insulation Resistance requirements. The excellent drainage promoted by NS-F900 results in reduced bridging.

SN100C Lead-free BGA Solder Spheres have high impact strength, comparable to tin-lead, for BGA, CSP, MCM and other high density area-array packages. The nickel-stabilized interfacial intermetallic is free of the incipient cracking that reduces resistance to impact loading in other lead-free solders.