Nihon Superior to Exhibit Advanced Soldering Materials at INTERNEPCON JAPAN 2011

SN100C P602 D4 is completely halogen-free, which means there are no intentional halogens of F, Cl, Br or even I hidden in the chemistry. The SN100C alloy delivers a Silver-free stable microstructure in an alloy that can accommodate the long-term cyclic strains and impact strains to which a solder joint can be subjected.

The lead-free paste has smooth bright fillets with few shrinkage defects and a stable microstructure with minimal growth of the interfacial intermetallic, resulting in highly reliable solder joints. SN100C provides excellent printing and reflow in fine-pitch circuitry, low hot and cold slump, and good coalescence and wetting with no solder balls.

SN100C P603 D4 and SN100C P605 D5/D6 Dispensing Grade Completely Halogen-Free Lead-Free Solder Pastes offer superior dispensing stability with continuous deposit on pad capability. SN100C P605 D5/D6 is optimized for high precision delivery with chip components down to 01005(0402 metric). The pastes are completely halogen-free contributing to improved reliability, high productivity and cost reduction.

SN100C (044) Completely Halogen-Free High Workability Flux-Cored Solder Wire has a high first pass yield contributed to its excellent wettability and spreading, while providing an approximately 30 percent faster soldering speed in manual soldering when compared to the previous halogen-free flux-cored solder wire.

NS-F900 is a robust, heat resistant, no-clean rosin containing wave soldering flux that is completely halogen-free. It provides high performance with high preheat temperature profiles, allowing high topside board temperatures (up to 125°C) and long dwell times that may be required for thick boards and dense, complex assemblies while being environmentally friendly. NS-F900 is specifically designed for use with SN100C (Sn-Cu-Ni+Ge) lead-free solder but is applicable to all lead-free alloys as well as Sn/Pb in wave soldering.

NS-F900 is designed to provide good hole-fill and easy solder joint inspection with little residue, while meeting JIS and J-STD-004 Surface Insulation Resistance requirements. The flux’s excellent drainage results in reduced bridging and solder shorts.

SN100C Lead-free BGA Solder Spheres have high impact strength comparable to tin-lead for BGA, CSP, MCM and other high density area-array packages. The nickel-stabilized interfacial intermetallic is free of the incipient cracking that reduces resistance to impact loading in other lead-free solders.