New Reflow Oven Introduced by APS Novastar

24th January 2011

ES Admin

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APS Novastar (http://www.apsgold.com) announces the introduction of the ERO-500 Reflow Soldering System. The addition of the ERO-500 reflow oven fills out the mid-range of APS Novastar's reflow product line, providing its customer base with a cost-effective conveyor reflow oven with five (5) vertical heating zones and one (1) cooling zone. The ERO-500 has been developed for small to medium volume reflow soldering of SMT boards, hybrid boards, and curing of glue or thick film pastes.

With a maximum system temperature of 320°C, reflow profiles can be optimized on the new ERO-500 Reflow Soldering System for lead-free and lead solder profiles. Each heating zone is independently programmable and easily controlled through the on-board LCD system controller. Optimizing reflow profiles can be accomplished with maximum flexibility in defining a reflow profile's conveyor speed, heating temperature, convection heat flow, and cooling fans.

Plenum convection heating technology provides uniform temperature profiling across the PCB board for enhanced SMT process control. Reflow profiling is capable with on-board programming and ability to attach three (3) thermocouples to the board. A data port is included for downloading of profile data and error logs.

The ERO-500 rounds out our reflow oven product line. We can now offer SMT OEM assemblers looking for solutions to their small and medium volume production or prototyping needs with a full range of reflow oven products to address their specific applications, says John Malboeuf, APS Novastar's Vice President, World-Wide Sales. The cost-effective, five (5) zone, lead-free capability of the ERO-500 will appeal to these assemblers and make turnkey assembly packages even more affordable.