Pending
Multitest Experts to Present PCB Pad Wear Analysis Findings at BiTS 2011
Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Valts Treibergs, R&D Engineering Manager, and Chris Cuda, US Product Manager, will present “PCB Pad Wear Analysis at 0.4 mm Pitch ― the Story Continues…” at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ. The presentation will be held during Session 5, which will take place Tuesday, March 8, 2011 at 1:30 p.m.
The intent of this presentation is to follow up on the PCB Pad Wear presentation from BiTS 2010. Last year’s presentation focused on the mechanical interaction of various probe tip geometries of socket contacts in 0.8 mm pitch, offset PCB pads. This year’s presentation will expand the study to the realm of fine-pitch by studying 0.4 mm pitch pads, with typical via-in-pad construction. An investigation with results of pad wear with three different spring probe tip styles, as well as socket configurations with various levels of preload resulting in probe chatter will be presented. Additionally, different types of PCB pad finishes will be discussed, as well as pros and cons of the alternative plating formulations with respect to mechanical wear due to spring probes.
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