Fast cure, high performance encapsulant from Intertronics

The fast cure on exposure to long wave UV and visible light minimizes processing and energy costs associated with alternative technologies that require mixing or elevated temperatures for curing. The 9001-E materials are all one part, so no mixing is required and consistent viscosity is maintained – in addition various viscosities are available from 400cP to 50,000cP to provide optimal coverage over various geometries.

Multi-Cure 9001-E series materials have high ionic purity, are solvent free, and isocyanate free. They have been engineered to have a low modulus to minimize stress on delicate wire bonds. When exposed to UV/visible light they will cure in seconds, while any shadowed areas will cure upon heat exposure. To prevent damage of fine wires, these encapsulants contain no sharp, abrasive mineral or glass fillers. They may be dispensed from a variety of automatic bench-top syringe applicators or other equipment and require only relatively low cost light sources to instigate the curing process.

Multi-Cure 9001-E Series encapsulants display excellent adhesion to polyimide, PET, flexible printed circuits, FR4 and ceramic boards, and provide superior protection for glob top and COB (chip on board) applications. They are ideal for encapsulating ICs on flex circuits, also for multi-chip modules.