MIRTEC to Showcase AOI and SPI Inspection Systems at NEPCON South China 2010

The MV-7xi In-Line AOI System features a Five Mega Pixel digital camera, with a Precision 9.8 Micron Telecentric Compound Lens and Five Mega Pixel Side-View Cameras. This advanced technology is configured with MIRTEC’s exclusive Intelli-Scan Laser System. The system provides the “Third Dimension” in inspection capability, the ability to precisely measure the Z-height of a given region of interest. Using simple and fast programming tools, the MV-7xi In-Line AOI System provides superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices and enhanced solder paste measurement capability. The patented “Quad Angle Lighting System” provides four independently programmable zones for optimal illumination of inspection areas.

MIRTEC also will show the industry’s most widely accepted Five Camera Desktop AOI system, the MV-3 Series Desktop AOI System. The MV-3 Series features the Intelli-Beam Laser System and is configured with a Top-Down View Five Mega Pixel camera. The system also features Precision 9.8 Micron Telecentric Compound Lens and four Five Mega Pixel Side-View Cameras and a Remote Debugging Function for perfect re-inspection by the operator with 360° images from side on defect.



The MIRTEC MS-11 In-Line SPI System uses Shadow Free Moiré Phase Shift Imaging Technology and ‘Phase Stepping Image Processing’ to inspect solder paste deposition on PCB’s post-screen print. Far superior to laser SPI technology, the MS-11 will inspect for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. The MS-11 is configured with an ultra high-resolution Two Mega Pixel Camera System for enhanced image quality and superior accuracy and uses the same robust platform as MIRTEC’s MV-7 Series.

MIRTEC also will feature LED Inspection machines MV-7SB and MV-7XP. The LED BLU Inspection system, MV-7SB, is designed for LED alignment and pitch inspection as well as inspection of the LED angle on BLU array. The LED Packaging inspection system, MV-7XP, provides simple and fast programming to inspect flipped components on LED Packages. Additional systems on display include the BGA rework machine, MR-2 Reworks Series, for fast and effective BGA reworking and the PCB Counter machine, MC-2 Counter Series, for PCB counting with a fast, user friendly detail management system.

Visitors to the MIRTEC booth also will be able to find out more about the Intellisys® total quality management system software that enables continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies. The software also provides monitoring of up to eight production lines and remote debugging, allowing MIRTEC customers to optimize the efficiency of their inspection process. Typical programming time is less than an hour per assembly and allows the user to track and eliminate defects on inspected assemblies.

MIRTEC will unveil its most technologically advanced AOI and SPI products to the electronics manufacturing industry at NEPCON South China 2010 and looks forward to welcoming visitors to its booth 2B21 during the event. For further information please visit www.mirtec.com.