Laird Technologies’ Tflex XS400 Series Thermal Gap Filler Wins Military Embedded Systems Magazine Editor's Choice Award

“Laird Technologies is proud to win the Editor's Choice award from Military Embedded Systems magazine because it reinforces our commitment to excellence. This proves that we are committed to top quality standards and that our products are diverse enough for even military applications,” said Mark Wisniewski, Laird Technologies Thermal Interface Materials Product Director. “Tflex™ XS400 is a great new product with superior compliance for those applications that require thermal performance and also some electrical isolation as well.”

The Tflex™ XS400 Series is the latest thermal pad in the Tflex™ thermal gap filler line, offering a compliant elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.0 W/mK. This soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.

“Tflex™ XS400 is an intriguing and trendsetting thermal management product, taking a new spin on an existing engineering concept,” said Chris A. Ciufo, OpenSystems Media, Group Editorial Director, Military and Aerospace Group. “The utility of this pure COTS filler in defense applications is obvious. Therefore, it was presented with an Editor’s Choice award based on this capability.”

Available in thicknesses from 0.020 inch (0.50 mm) through 0.200 inch (5.0 mm) in 0.010 inch increments, the Tflex™ XS400 thermal material is naturally tacky for easy assembly and no adhesive coating is required. Due to its TG (Tgard™) liner on the other side, it is electrically insulating, stable from -40°C to 160°C, and is certified to UL 94V0 flammability rating; complying with the limits of RoHS Directive 2002/95/EC and its subsequent amendments.