Laird Technologies Releases New Tflex XS400 Series Thermal Gap Filler

The Tflex™ XS400 Series is the latest thermal pad in the Tflex™ thermal gap filler line, offering a compliant elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.0 W/mK. This soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.

Available in thicknesses from 0.020 inch (0.50 mm) through 0.200 inch (5.0 mm) in 0.010 inch increments, the Tflex™ XS400 thermal material is naturally tacky for easy assembly and no adhesive coating is required. Due to its TG (Tgard™) liner on the other side, it is electrically insulating, stable from -40°C to 160°C, and is certified to UL 94V0 flammability rating; complying with the limits of RoHS Directive 2002/95/EC and its subsequent amendments.

“The Tflex™ XS400 gap filler is an easy-to-handle thermal pad that possesses low outgassing properties,” said Jane Bell, Laird Technologies Thermal Interface Materials Product Manager. “It is an excellent choice for telecom, IT, consumer, automotive, LED, and power supply applications which require a gap pad between heat generating components and heatsinks, and provides electrical isolation with the ability to absorb high tolerance stack-up.”