Laird Technologies Releases Enhanced Tlam SS LLD Thermally Conductive PCB Substrate

A copper circuit layer and aluminum or copper base plate are bonded together with an LLD dielectric, which is essential to the high-performance of the PCB substrate. The dielectric can fit, and is processed through, standard FR4 print-and-etch operations without various parameter modifications. These dielectrics provide electrical isolation, thermal transfer, and an adhesion layer for the substrate.

“The enhanced Tlam SS LLD substrate improves thermal transference from the heat source to the heat sink through PCBs, reducing the thermal stress placed on the PCB,” commented Jeffrey Chuang, Laird Technologies Tlam Product Manager. “These new improvements benefit the LED market by providing a higher performing, lower cost thermal interface that extends operational life to the LED apparatus.”

The Tlam SS LLD boards are processed through standard pick-and-place surface mount technology (SMT) and manual wire bond operations. Standard constructions are made with one or two ounce copper and 0.040 (1) or 0.059 (1.5) inch (mm) thick aluminum, grade 5052; 0.040 (1) or 0.062 (1.6) inch (mm) thick aluminum, grade 6061; with a copper base available.

As the minimization of electronic devices continues to pack increasing power into smaller packages, Laird Technologies continues to excel at designing industry-leading, thermally-conductive PCB substrates for applications requiring the best thermal performance and resistance to thermal cycling.