Kyzen’s Dr. Mike Bixenman to Present at the Cleaning Electronic Assemblies Workshops in Texas

Throughout the event, Dr. Bixenman will give two presentations including:

Contamination and Its Effect on PCBs ― Increased electrical device functionality results from closer spacing between conductors and more functions in a smaller area. Process- and service-related contaminants accelerate the potential for device failures. This presentation will discuss how clean is clean, ionic residues, electro-migration and electrochemical migration. The audience will gain insight into sources of contamination, risks of these contaminants and how to mitigate these concerns.

The Five Forces of Cleaning ― Both packaging and printed circuit board designs are susceptible to electrical, mechanical and thermal modes of failure. With miniaturization, residues from the soldering process create greater concerns. This presentation goes into the cause and effect factors centered on the soil, heat exposure, gap height, cleaning agents and cleaning machines. The audience will learn proven methodologies for designing cleaning into the assembly.

Co-founder and CTO of Kyzen, Dr. Mike Bixenman has more than 35 years of experience in the precision cleaning field, and is an active researcher and innovator. Dr. Bixenman chaired the IPC-CH-65B Cleaning Handbook that will be released this fall and the IPC-7526 Stencil Cleaning Handbook.