Kester features Next Generation Solder Paste and Flux at SMT Nuremberg

Kester’s pioneering new lead-free no-clean solder paste, NXG1, has been developed with cutting-edge capabilities, including ultra-low BGA voiding, superior wetting and excellent joint appearance. Providing superior printing and the longest shelf life available, NXG1 features exceptional process robustness that opens the process window in the stencil printer and the reflow oven.

Kester solders are known around the world for flux consistency and are designed to increase yields and joint reliability. In response to the burgeoning solar industry, Kester has developed a series of no-clean flux to support customers in this sector. Included in the range is the 979T, a 100% VOC-free, no-clean flux formulation for high quality, low defect soldering. Designed specifically for tab attachment, the product offers high reliability with low residues after soldering that are benign and non-conductive. 979T VOC-Free No-Clean Flux is specially formulated with a unique proprietary blend of organic activator systems to offer the best wetting and topside hole fill and shiniest solder joints.

Kester 985M Lead-Free No-Clean Alcohol-Based Flux is specially designed to improve effectiveness in the wave soldering of conventional circuit board assemblies. This flux was developed for excellent solderability and through-hole fill in lead-free wave soldering process. 985M minimizes micro-solderballing at connectors and CPU. Its residue left behind is non-tacky, non-corrosive and non-conductive