Home > Pending > Join Kyzen’s Dr. Mike Bixenman at IPC Midwest 2011 for a Discussion on Cleaning Challenges in an HDI World

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Join Kyzen’s Dr. Mike Bixenman at IPC Midwest 2011 for a Discussion on Cleaning Challenges in an HDI World

26th August 2011

Kyzen Corporation

ES Admin

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Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Dr. Mike Bixenman along with Mark Northrup and Andy Buchan of IEC Electronics, Joe Russeau of Precision Analytical, and Tim Jensen of Indium Corporation will present “Cleaning Challenges in an HDI World” at the upcoming IPC Midwest Exhibition and Conference scheduled to take place September 21-22, 2011 at the Renaissance Schaumburg Hotel and Convention Center in Schaumburg, IL. The presentation will be held during Session S01, titled “Test and Measurement Solutions,” which will take place on Wednesday, September 21 from 9 a.m.-12 p.m.

For many years, there has been a vast disconnect between the engineers that design the assembly and the chemists responsible for developing the assembly materials. In short, engineers and chemists do not speak the same language. In today’s HDI environment, this disconnect can cause more issues than it solves. The challenges of cleaning the smaller pitched components used in the HDI world means that the two disciplines need to align to better understand how clean is clean enough.

The purpose of this research is to build a new test board that provides accurate correlation and prediction of the effects of assembly residue on reliability. The card is designed for SIR and ECM testing using high voltage, low level leakage current, frequency and high potential electrical effects.

Co-founder and CTO of Kyzen, Dr. Mike Bixenman has more than 35 years of experience in the precision cleaning field, and is an active researcher and innovator. Dr. Bixenman chaired the IPC-CH-65B Cleaning Handbook and the IPC-7526 Stencil Cleaning Handbook.