IBM¹s CMOS image sensing technology now available at low cost through MOSIS multi-project wafer services

The IBM CIMG7SF process utilizes180nm technology to produce a 4-transistor, 3.0µm reference pixel. It incorporates fully integrated colour filters and webbed microlenses for high quantum efficiency and wide viewing angles. The surface area that is sensitive to light is maximized, allowing adjacent microlenses to overlap, and photodiode technology minimizes dark current. The process uses aluminium for the last metal layer and copper wiring for the remaining metal layers. Thin back end-of-line metal stacks and good dielectric tolerance make the process suitable for most imaging requirements.
The MOSIS MPW service is based on 8-inch wafers with a reticle size of 18 x 20mm. Approximately 60 reticle copies are stepped on the wafer. Typical turn-around time from release of the design to manufacturing is less than 60 days.

MOSIS Deputy Director, Wes Hansford, comments, “The growth in demand for color imaging continues to accelerate as it becomes more affordable in an ever-widening range of consumer electronic products. This new MPW service gives imaging system designers access to affordable prototyping and low volume production, minimizing both their design risks and costs. Because they can often get evaluation samples into the hands of customers earlier using MPW, it can also shorten time-to-market, which is a crucial success factor for consumer devices.”