Europlacer to Exhibit Flexible SMT Placement Systems at IPC APEX EXPO 2011

Winner of the Global Technology and NPI Awards in 2008, the iineo platform features many enhancements to the Europlacer machine range, such as a high feeder count, increased board size and increased maximum component height. The platform uses the company’s proven core features, which include turret head, intelligent feeders and powerful software — while introducing technologies such as linear motors and digital cameras.



iineo is widely configurable, allowing for numerous different possibilities:

• Single or dual linear motor gantry including a rotary turret head with eight or 12 pickups

• One or two board positioning mechanisms

• Oversized board options

• Huge feeder capacity to front and rear, or front only



The dual-head iineo–II VLB is the latest enhancement to the Europlacer product portfolio, designed for the growing LED assembly segment. The assembler can accommodate PCBs as large as 24W x 63L, making it perfectly suitable for handling LED form factors, particularly industrial fluorescent lighting. Keeping with the Europlacer tradition of protecting its customers’ investment, the VLB transport system can be quickly/easily converted to handle large, typical sized PCBs (up to 18 x 20).



Winner of the 2010 NPI Award, the XPii-II is a new approach to modular pick-and-place, incorporating technology from Europlacer’s innovative award-winning iineo platform. XPii benefits from low-maintenance linear motors, high-resolution digital cameras and advanced on-head optical component sensing. With these advanced features, users benefit from all of the capabilities of the iineo in a compact space. As an additional benefit, the modularity enables users to size lines to meet growing demands.



XPii-II features two placement heads and uses Europlacer’s proven core features, such as turret head, intelligent feeders and powerful software without compromise. It is equipped with a choice of turret heads and incorporates optical sensors that can detect ― on-the-fly ― the presence of components as small as 01005 and as large as 4 long connectors. XPii- II will accommodate components supplied on tape, strip tape, stick and matrix trays.



The system uses Europlacer’s unique Integrated Intelligence™ and fulfills all possible placement needs in one compact system. It is widely configurable, allowing two versions: eight or 12 nozzles, tape trolleys or feeder trolleys, a matrix tray sequencer and an internal matrix tray. Unlike traditional chip-shooter style machines, XPii-II has no restrictions or limitations on component range.



The SP700avi Automatic Screen Printer combines Speedprints’ commitment to high performance and reliability with outstanding value. The system was designed to cope with the rigors of high-volume SMT production while incorporating the flexibility needed in high-mix, quick product set-up and changeover environments.



The screen printer was designed with ease of use, maintenance and low cost of ownership in mind. The system utilizes the most advanced drive control technology available, including one micron resolution linear encoders on all axes, combined with a suite of intuitive software that enables total control of the printing process.



The SP700avi comes fully equipped with many features, including automatic rail width adjust, auto stencil loading and a fully programmable Under Stencil Cleaner.